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| IPB180N03S4L-01 OptiMOS(R)-T Power-Transistor Product Summary V DS R DS(on) ID 30 1.05 180 V m A Features * N-channel - Enhancement mode * AEC qualified * MSL1 up to 260C peak reflow * 175C operating temperature * Green package (RoHS compliant) * Ultra low Rds(on) * 100% Avalanche tested PG-TO263-7-3 Type IPB180N03S4L-01 Package PG-TO263-7-3 Marking 4N03L01 Maximum ratings, at T j=25 C, unless otherwise specified Parameter Continuous drain current Symbol ID Conditions T C=25C, V GS=10V1) T C=100 C, V GS=10 V2) Pulsed drain current2) Avalanche energy, single pulse2) Avalanche current, single pulse Gate source voltage Power dissipation Operating and storage temperature IEC climatic category; DIN IEC 68-1 I D,pulse E AS I AS V GS P tot T j, T stg T C=25 C T C=25 C I D=90 A Value 180 180 720 530 180 16 188 -55 ... +175 55/175/56 mJ A V W C Unit A Rev. 0.1 page 1 2009-11-19 IPB180N03S4L-01 Parameter Symbol Conditions min. Values typ. max. Unit Thermal characteristics2) Thermal resistance, junction - case SMD version, device on PCB R thJC R thJA minimal footprint 6 cm2 cooling area3) Electrical characteristics, at T j=25 C, unless otherwise specified Static characteristics Drain-source breakdown voltage Gate threshold voltage Zero gate voltage drain current V (BR)DSS V GS=0 V, I D= 1 mA V GS(th) I DSS V DS=V GS, I D=140 A V DS=30 V, V GS=0 V, T j=25 C V DS=18 V, V GS=0 V, T j=85 C2) Gate-source leakage current Drain-source on-state resistance Drain-source on-state resistance I GSS R DS(on) RDS(on) V GS=16 V, V DS=0 V V GS=4.5 V, I D=90 A V GS=10 V, I D=100 A 30 1 1.5 0.01 2.2 1 A V 0.8 62 40 K/W - 5 1 1.2 0.9 60 100 1.4 1.05 nA m m Rev. 0.1 page 2 2009-11-19 IPB180N03S4L-01 Parameter Symbol Conditions min. Values typ. max. Unit Dynamic characteristics2) Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Gate Charge Characteristics2) Gate to source charge Gate to drain charge Gate charge total Gate plateau voltage Reverse Diode Diode continous forward current2) Diode pulse current2) Diode forward voltage Reverse recovery time2) Reverse recovery charge2) 1) C iss C oss Crss t d(on) tr t d(off) tf V DD=15 V, V GS=10 V, I D=100 A, R G=1.6 V GS=0 V, V DS=25 V, f =1 MHz - 13500 3370 125 8 5 57 23 17600 pF 4400 250 ns Q gs Q gd Qg V plateau V DD=24 V, I D=180 A, V GS=0 to 10 V - 39 25 187 3.1 51 50 239 - nC V IS I S,pulse V SD t rr Q rr T C=25 C V GS=0 V, I F=100 A, T j=25 C V R=20 V, I F=100A, di F/dt =100 A/s - 0.9 180 200 180 720 1.3 - A V ns nC Current is limited by bondwire; with an R thJC = 0.8 K/W the chip is able to carry 335A at 25C. Defined by design. Not subject to production test. 2) 3) Device on 40 mm x 40 mm x 1.5 mm epoxy PCB FR4 with 6 cm 2 (one layer, 70 m thick) copper area for drain connection. PCB is vertical in still air. Rev. 0.1 page 3 2009-11-19 IPB180N03S4L-01 1 Power dissipation P tot = f(T C); V GS 6 V 2 Drain current I D = f(T C); V GS 6 V 200 175 150 200 180 160 140 125 120 P tot [W] 100 75 50 I D [A] 0 50 100 150 200 100 80 60 40 25 0 20 0 0 50 100 150 200 T C [C] T C [C] 3 Safe operating area I D = f(V DS); T C = 25 C; D = 0 parameter: t p 1000 1 s 10 s 4 Max. transient thermal impedance Z thJC = f(t p) parameter: D =t p/T 100 0.5 100 s 100 1 ms 10-1 0.1 Z thJC [K/W] 0.05 I D [A] 0.01 10 10-2 single pulse 1 0.1 1 10 100 10-3 10-6 10-5 10-4 10-3 10-2 10-1 100 V DS [V] t p [s] Rev. 0.1 page 4 2009-11-19 IPB180N03S4L-01 5 Typ. output characteristics I D = f(V DS); T j = 25 C parameter: V GS 6 Typ. drain-source on-state resistance R DS(on) = (I D); T j = 25 C parameter: V GS 14 600 5V 10 V 4.5 V 4V 12 3V 3.5 V 500 10 400 R DS(on) [m] 8 I D [A] 300 3.5 V 6 4V 200 4 100 3V 2 4.5 V 5V 0 0 1 2 3 2.5 V 10 V 0 4 0 100 200 300 400 500 600 V DS [V] I D [A] 7 Typ. transfer characteristics I D = f(V GS); V DS = 6V parameter: T j 500 8 Typ. drain-source on-state resistance R DS(on) = f(T j); I D = 80 A; V GS = 10 V 1.75 400 1.5 R DS(on) [m] 300 1.25 I D [A] 200 175 C 1 100 25 C -55 C 0.75 0 1 2 3 4 5 0.5 -60 -20 20 60 100 140 180 V GS [V] T j [C] Rev. 0.1 page 5 2009-11-19 IPB180N03S4L-01 9 Typ. gate threshold voltage V GS(th) = f(T j); V GS = V DS parameter: I D 2 1.75 1400 A 10 Typ. capacitances C = f(V DS); V GS = 0 V; f = 1 MHz 105 1.5 140 A 104 Ciss 1.25 V GS(th) [V] C [pF] 1 0.75 0.5 0.25 Coss 103 Crss 0 -60 -20 20 60 100 140 180 0 5 10 15 20 25 30 T j [C] V DS [V] 11 Typical forward diode characteristicis IF = f(VSD) parameter: T j 103 12 Typ. avalanche characteristics I AS = f(t AV) parameter: T j(start) 1000 102 100 150 C 25 C 100 C 175 C 25 C 101 I AV [A] 10 1 1 1.2 1.4 0.1 I F [A] 100 0 0.2 0.4 0.6 0.8 1 10 100 1000 V SD [V] t AV [s] Rev. 0.1 page 6 2009-11-19 IPB180N03S4L-01 13 Typical avalanche energy E AS = f(T j) parameter: I D 1250 14 Drain-source breakdown voltage V BR(DSS) = f(T j); I D = 1 mA 34 45 A 33 1000 32 V BR(DSS) [V] 750 E AS [mJ] 31 90 A 500 30 180 A 250 29 0 25 75 125 175 28 -60 -20 20 60 100 140 180 T j [C] T j [C] 15 Typ. gate charge V GS = f(Q gate); I D = 80 A pulsed parameter: V DD 12 16 Gate charge waveforms V GS 10 Qg 8 8V V GS [V] 24 V 6 4 2 Q gs Q gd Q gate 0 0 30 60 90 120 150 180 Q gate [nC] Rev. 0.1 page 7 2009-11-19 IPB180N03S4L-01 Published by Infineon Technologies AG 81726 Munich, Germany (c) Infineon Technologies AG 2008 All Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office (www.infineon.com). Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev. 0.1 page 8 2009-11-19 IPB180N03S4L-01 Revision History Version Date Changes Rev. 0.1 page 9 2009-11-19 |
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